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I received my Bachelors in Mechanical Engineering in 2015 from the American University of Beirut, Lebanon, and my Masters of Science in Engineering in 2017 from the Southern Methodist University in Dallas, Texas. I am currently a doctoral candidate at SMU and research assistant at Nanoscale Electro-Thermal Sciences Lab (NETSL). My research interests are in thermal characterization of microelectronic structures and high power devices using combined thermoreflectance metrology and 3D self-adaptive numerical simulations. I am skilled in numerical analysis (Matlab, LabVIEW, Mathematica and ANSYS) and experimental design using optical, thermal, and electronic systems (LabVIEW, NI DAQ). I have served as a PhD researcher, PhD teaching assistant and lab instructor. During my PhD, I gained knowledge of thermal analysis and computational methods with interdisciplinary knowledge of solid state physics and semiconductor devices. I also obtained cleanroom training and gained experience in electronic microfabrication.

Experience

Research Assistant

Southern Methodist University
Aug 2017 – Present
2 yrs 10 mos
Dallas/Fort Worth Area
Currently a researcher at the Nanoscale Electrothermal Sciences Lab. Research interests in thermal management of microelectronic devices, surface temperature metrology, thermo-physical property measurements of thin films, and multiscale adaptive numerical thermal modeling. Experimental work consists of laser based thermo-reflectance single point temperature measurements and camera based TR thermal mapping. Project applications in high power Si and GaN devices, back-end of line IC interconnects, and neuromorphic memristive components.

Teaching Assistant for Thermodynamics

Southern Methodist University
Aug 2015 – May 2017
1 yrs 10 mos
Dallas/Fort Worth Area
Held the position of Thermodynamics Lab instructor for two years assuming responsibility of instructing 24 students each semester about thermodynamic processes and guiding them through experimentation and technical writing.

Engineering Intern

TMX Scientific
May 2016 – Jul 2016
2 mos
Richardson, TX
Prototyping and development of thermal imaging systems. Instrumentation and controls using NI-Visa and user interface design. Designing and assembling high sensitivity system for measuring thermo-reflectance coefficient of gold covered microelectronic wafers. Numerical modeling of heat transfer in microelectronic devices Data collection, statistical analysis and presentation of experimental testing results.

Technical Skills

Instrumentation, Data Collection, and Data Analysis

LabVIEW, Simulink, NI-Visa, NI My-DAQ

Numerical Modeling and Engineering Analysis

Proficient in MATLAB, Mathematica and Excel

Design and Optimization of Thermal Fluids Systems

Thermal mechanical modeling using ANSYS Fluent, IcePak, MATLAB

Microelectronics/MEMS Thermal Design and Reliability

Thermoreflectance imaging (TMX T°Imager), multi-scale numerical thermal modeling (TMX T°Solver), wafer probing

Semiconductor Fabrication and Processing

Metals and Dielectrics Thin Films Deposition (CVD, cryo e-beam, ion-beam sputtering), Lithography, Etch, Diffusion, Wet Process

Mechanical Design and Prototyping

AutoCAD Inventor, 3D printing, Mechanical fabrication

Soft Skills

Research, Data Analysis, Optimization, Presentation, Programming, Logical Reasoning, Creative Thinking, Problem Solving, Teamwork, Verbal Communication, Commitment